Friday, September 4, 2015
The U.S. trade deficit fell in July to the lowest level in five months as exports posted a small gain while imports declined, reflecting a big drop in shipments of consumer goods such as cell phones.
World finance ministers and central bankers gather in Turkey this weekend to grapple with the fallout of slowing growth in mainland China, tanking emerging economies and panicked global stock markets.
The U.S. dollar rose against the New Taiwan dollar Thursday, gaining NT$0.039 to close at NT$32.801 as Taiwan's central bank continued its intervention to vault the greenback back into positive territory by the close, dealers said.
Mega International Commercial Bank (兆豐商銀), the banking flagship of Mega Financial Holding Co. (兆豐金), said Thursday that it is scheduled to open a branch in Abu Dhabi in the United Arab Emirates (UAE) in early 2016, eyeing an increase in business opportunities in the Middle East.
Fuel prices in Taiwan are expected increase next week after a recent technical rebound in international crude oil prices, but concerns over a supply glut remained in place, market sources said Thursday.
Shares in Taiwan closed higher Thursday as investors were encouraged by a strong technical rebound on Wall Street overnight in the wake of a U.S. Federal Reserve report signaling optimism toward the U.S. economic climate, dealers said.
Taiwan-based Hon Hai Precision Industry Co. (鴻海), the world's largest contract electronics maker, is in talks with mainland Chinese smartphone brand OPPO to roll out smartphones in India, according to a report by India's Economic Times.
Three e-commerce events, namely Taiwan's first "eCommerce Expo Asia," the "Asia eCommerce Forum" and "eCommerce Business Day" will be combined together from Oct. 6-9 in Taipei, said the Taiwan External Trade Development Council (TAITRA, 外貿發展協會), yesterday.
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa" or "K&S") has announced a new addition to its Advanced Packaging with Adaptive Machine Analytics (APAMA) series of highly adaptive thermo-compression (TC) bonders called the C2W (chip-to-wafer) bonder.