Upbeat forecast for IC testing, packaging
The China Post news staffTAIPEI, Taiwan -- The integrated circuit testing and packaging industry is expected to have a bullish year due to an expansion of capacity and increasing orders, said Digitimes Research yesterday.
February 6, 2013, 11:35 am TWN
According to Digitimes, IC testing and packaging operators are expected to see first-half growth stay the same or rise by a slight margin compared to the same period last year, due to clients' inventory digestion effort. Yet in the second half, growth will be significant as the world walks out of the shadows of the European debt crisis, it said.
Smartphones and other mobile Internet devices will continue to drive the growth of IC testing and packaging operators, who may also get more orders from independent device manufacturers.
An expansion of capacity and increasing orders for high-end IC testing and packaging are expected to drive the industry, the production value of which is set to grow by a bigger margin this year on a year-on-year basis than in 2011 and 2012, the market research firm said.
“Back in 2011 and 2012, testing and packaging production value stood at US$22.52 billion and US$23.02 billion, a rise of 3.8 percent and 2.2 percent, respectively, on a year-on-year basis,” Digitimes said. “This year, production is set to grow by a bigger margin.”
According to Digitimes, the European debt crisis had caused clients to reduce orders and lower inventories. Yet, with the debt crisis slowly dissipating, clients will stock up on goods and send more orders to testing and packaging operators, it said.