TSMC begins heterogeneous 3D IC production
CNATAIPEI -- Taiwan Semiconductor Manufacturing Co.(TSMC) announced yesterday successful volume production of U.S.-based Xilinx Inc.'s Virtex-7 HT FPGAs, the world's first heterogeneous 3D ICs in production.
October 22, 2013, 12:06 am TWN
TSMC said in a statement that with this milestone, all Xilinx 28nm 3D IC families are now in volume production.
The 28nm devices were developed on TSMC's Chip on-Wafer-on-Substrate (CoWoS) 3D IC process that makes it possible to integrate multiple components on a single device.
Victor Peng, senior vice president and general manager of products at Xilinx, said in the statement that collaborating with TSMC to successfully reach CoWoS volume production cements Xilinx's position as both a pioneer and industry leader in 3D IC technology and products.
“Working together, we have honed the procedures and technologies to produce the next generation of groundbreaking, CoWoS-based 3D ICs, and are now positioned to leverage TSMC's 20SoC and 16nm FinFET process with our UltraScale architecture to further our industry lead,” Peng said.
Peng's statement was seen as signaling that the success in 28 nm process technology would help TSMC win Xilinx orders for chips on TSMC's new 20nm and 16FinFET process technologies.
“This achievement at 28nm positions Xilinx for further success with TSMC's proven 20SoC and 16FinFET processes, enabling the company to extend its leadership in All Programmable 3D ICs,” TSMC said in the statement.
According to the statement, Xilinx has used the 28nm process to produce the world's leading high-capacity and high-bandwidth programmable logic devices targeted at the next generation of wired communications, high-performance computing, and medical image processing.