Semiconductor summit to begin in Taipei on Sept. 5
September 3, 2012, 12:24 am TWN
TAIPEI--High-ranking executives from leading semiconductor companies are scheduled to meet Sept. 5 in Taipei to share their views on industry trends.
The Executive Summit will comprise four keynote speeches and a panel discussion on Taiwan's strategic role and opportunities in the semiconductor industry, according to the organizers.
The keynote speakers will include Graham Budd, chief operating officer of British chipset designer ARM Holdings PLC, and Mark Durcan, chief executive officer of U.S. memory chip maker Micron Technology Inc.
Mark Liu, co-chief operating officer of Taiwan Semiconductor Manufacturing Co., and Peter Bocko, chief technology officer of Corning Glass Technologies, will also speak on next-generation solutions for semiconductors, the organizers said.
The meeting is being organized by Semiconductor Equipment and Materials International (SEMI) as part of a global semiconductor trade show in Taiwan.
Some 600 exhibitors from 170 countries have registered to participate in the SEMICON Taiwan show, which is projected to attract 30,000 visitors.
SEMI forecast in July that global annual semiconductor equipment sales will contract by 2.6 percent this year, totaling US$42.4 billion.
Growth in 2012 is projected only in South Korea and Taiwan, the two largest markets for semiconductor equipment, which are expected to record sales of US$11.48 billion and US$9.26 billion, respectively, SEMI said.
In 2013, however, South Korea and North America will claim the top two spots, with equipment sales of US$12.14 billion and US$10.13 billion, respectively, SEMI said.
Taiwan will slip to third place with sales of US$9.16 billion, it forecast.