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Updated Tuesday, September 7, 2010 11:17 pm TWN, By Alan Fong, The China Post



	From left: Huang Kae, Christopher Wargo, Dr. Tong Ho-ming, Dr. Burn Lin, Dr. Ching Hu, Giuseppe Izzo, and Terry Tsao pose for photos during a news conference for the SEMICON Taiwan 2010, held yesterday. (Courtesy of SEMICON Taiwan) Enlarge Photo

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SEMICON Taiwan marks 15th anniversary

As the exponential advancement of miniaturization technology predicted by the once seemingly infallible Moore's Law, which states that the amount of transistors on a chip will double roughly every two years, is questioned by its creator, Intel co-founder Gordon Moore, himself, the industry is looking for cutting-edge technologies to sustain its growth. One such emerging technology is MEMS; the groundbreaking mix of nanoelectromechanical systems (NEMS) and nanotechnology that has the potential to change the future for every silicon-related product.

Dr. Ching Hu, president of Touch Micro-system Technology Corp., pointed out that while wide application of MEMS is at its early stage and mass production of such technologies is still a challenge, the micro-system can revolutionize products such as mobile devices, game consoles, 3-dimensional projectors, pico-projectors, etc. One of the challenges facing Taiwanese manufacturers is their lack of know-how in developing a humanized interface, Hu said.

Another way around Moore's Law is the 3D IC and packaging technologies, said Dr. Tong Ho-ming, general manager and chief technology officer of the ASE Group. Despite tremendous progress in recent years, 3D IC with through silicon vias (TSVs) still presents significant challenges in cost, design, manufacturing, test and supply chain readiness and the technology is still three to five years away from mass production, Tong said.

Innovation and cooperation are also needed in green semiconductor manufacturing, said Hsu Fang-ming, deputy-director of the Taiwan Semiconductor Manufacturing Company (TSMC). He called for the industry to work at both global and local levels to tackle the challenge.

Other executives at the panel included Dr. Burn Lin, senior director at TSMC's Nano Patterning Technology Division discussing the

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