The first topic is the next generation fab, as suppliers and chipmakers are looking to tackle key productivity bottlenecks and improve overall 300mm fab productivity. Many experts believe that a much-publicized initiative — 300mm prime — can push out or eliminate the argument for larger wafers by bolstering the use of efficient, high-mix manufacturing operations.

The second topic is an outlook for the solar industry, as the industry in Taiwan has been quietly but aggressively expanding.

The third topic is SiP and low-cost technologies, as visitors learn more about the challenges around implementing SiP into the product supply chain.

The fourth topic is seismic risk management, as manufacturers find ways to reduce seismic loss during an earthquake on the basis of engineering and non-engineering methods.

And finally, the fifth topic is used equipment, as the secondary market for surplus semiconductor manufacturing equipment and related services continues to evolve globally.

SEMICON Taiwan is held from Sept. 12 to 14 this year and features more than 750 exhibiting companies highlighting the latest products and services to support chip fabrication facilities, as well as a full range of programs focusing on business and technical challenges and opportunities facing companies today.

“Industry leaders require the most up-to-date information to make informed business decisions,” said Terry Tsao, president of SEMI Taiwan. “SEMICON Taiwan 2007 is the biggest and most comprehensive event of its type in our region, and it brings all of these topics together under one roof, giving visitors the opportunity to capitalize on new trends.”

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